High Strength Epoxy Binder and Injection Resin
KISEPO 20 is a high modulus, low viscosity, epoxy resign designed for injection into non-moving cracks in concrete structures. It’s medium to low viscosity will allow maximum penetration into gap widths of 0.25mm and above. KISEPO 20 exhibits extremely high strength when in cured state, thereby restoring structural integrity. It is moisture insensitive thereby allowing for repair works on damp cracks via simple injection.